H1B Salary Data
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14
records
Median
$158,922
Avg
$158,922
Min
$98,030
Max
$192,005
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Showing 1–14 of 14 results
Employer
Job Title
Base Salary ↓
City / State
Year
Submitted
Start Date
Intel Corporation
Packaging R&D Engineer
$192,005
Austin, TX
2025
2025-07-31
2025-10-01
Intel Corporation
Packaging R&D Engineer
$192,005
Austin, TX
2025
2025-07-31
2025-10-01
Intel Corporation
Packaging R&D Engineer
$181,314
Round Rock, TX
2025
2025-06-03
2025-10-01
Intel Corporation
Packaging R&D Engineer
$181,314
Round Rock, TX
2025
2025-06-03
2025-10-01
Intel Corporation
Packaging R&D Engineer
$179,650
Chandler, AZ
2024
2024-03-14
2024-08-28
Intel Corporation
Packaging R&D Engineer
$179,650
Chandler, AZ
2024
2024-03-14
2024-08-28
Intel Corporation
Packaging R&D Engineer
$177,200
Chandler, AZ
2025
2025-04-23
2025-10-01
Intel Corporation
Packaging R&D Engineer
$177,200
Chandler, AZ
2025
2025-04-23
2025-10-01
Intel Corporation
Packaging R&D Engineer
$161,117
Chandler, AZ
2023
2023-03-16
2023-09-08
Intel Corporation
Packaging R&D Engineer
$161,117
Chandler, AZ
2023
2023-03-16
2023-09-08
Intel Corporation
Packaging R&D Engineer
$117,146
Chandler, AZ
2022
2022-03-05
2022-08-21
Intel Corporation
Packaging R&D Engineer
$117,146
Chandler, AZ
2022
2022-03-09
2022-08-23
Intel Corporation
Packaging R&D Engineer
$110,011
Chandler, AZ
2022
2022-03-01
2022-08-15
Intel Corporation
Packaging R&D Engineer
$98,030
Chandler, AZ
2022
2022-03-09
2022-08-23