H1B Salary Data

Companies Job Titles Cities

Data sourced from U.S. Department of Labor LCA disclosures.

Contact: admin@h1bdata.net · Privacy Policy

Packaging R&D Engineer at Intel Corporation $179,650 | H1B Salary Data

← Back to Search

H1B Record: I-200-24074-799482

Case Number

I-200-24074-799482

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging R&D Engineer

SOC Code

11-9041.00 · Architectural and Engineering Managers

Base Salary

$179,650

Range: $179,650 – $221,610

Prevailing Wage

$179,650 · IV

Full Time

Yes

Location

Year

2024

Submitted Date

2024-03-14

Start Date

2024-08-28

End Date

2027-08-27