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Packaging R&D Engineer at Intel Corporation $181,314 | H1B Salary Data
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H1B Record: I-200-25154-044424
Case Number
I-200-25154-044424
Case Status
Certified
Visa Class
H-1B
Employer
Intel Corporation
Job Title
Packaging R&D Engineer
SOC Code
11-9041.00
· Architectural and Engineering Managers
Base Salary
$181,314
Range: $181,314 – $250,160
Prevailing Wage
$181,314
· III
Full Time
Yes
Location
Round Rock, TX
Year
2025
Submitted Date
2025-06-03
Start Date
2025-10-01
End Date
2028-09-30