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Packaging R&D Engineer at Intel Corporation $177,200 | H1B Salary Data

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H1B Record: I-200-25113-897391

Case Number

I-200-25113-897391

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging R&D Engineer

SOC Code

11-9041.00 · Architectural and Engineering Managers

Base Salary

$177,200

Range: $177,200 – $250,160

Prevailing Wage

$176,176 · III

Full Time

Yes

Location

Year

2025

Submitted Date

2025-04-23

Start Date

2025-10-01

End Date

2028-09-30