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Packaging R&D Engineer at Intel Corporation $98,030 | H1B Salary Data

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H1B Record: I-200-22068-962809

Case Number

I-200-22068-962809

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging R&D Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$98,030

Range: $98,030 – $114,340

Prevailing Wage

$98,030 · II

Full Time

Yes

Location

Year

2022

Submitted Date

2022-03-09

Start Date

2022-08-23

End Date

2025-08-22