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Packaging R&D Engineer at Intel Corporation $110,011 | H1B Salary Data

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H1B Record: I-200-22060-938814

Case Number

I-200-22060-938814

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging R&D Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$110,011

Range: $110,011 – $160,990

Prevailing Wage

$110,011 · III

Full Time

Yes

Location

Year

2022

Submitted Date

2022-03-01

Start Date

2022-08-15

End Date

2025-08-14