H1B Salary Data

Companies Job Titles Cities

Data sourced from U.S. Department of Labor LCA disclosures.

Contact: admin@h1bdata.net · Privacy Policy

Packaging R&D Engineer at Intel Corporation $161,117 | H1B Salary Data

← Back to Search

H1B Record: I-200-23075-852667

Case Number

I-200-23075-852667

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging R&D Engineer

SOC Code

11-9041.00 · Architectural and Engineering Managers

Base Salary

$161,117

Range: $161,117 – $221,610

Prevailing Wage

$161,117 · III

Full Time

Yes

Location

Year

2023

Submitted Date

2023-03-16

Start Date

2023-09-08

End Date

2026-09-07