H1B Salary Data

Companies Job Titles Cities

Data sourced from U.S. Department of Labor LCA disclosures.

Contact: admin@h1bdata.net · Privacy Policy

Packaging Engineer II at Medtronic, Inc $100,235 | H1B Salary Data

← Back to Search

H1B Record: I-200-25318-407132

Case Number

I-200-25318-407132

Case Status

Certified

Visa Class

H-1B

Employer

Job Title

Packaging Engineer II

SOC Code

17-2112.03 · Manufacturing Engineers

Base Salary

$100,235

Prevailing Wage

$100,235 · II

Full Time

Yes

Location

Year

2025

Submitted Date

2025-11-13

Start Date

2026-03-09

End Date

2029-03-08