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Packaging Development Engineering Manager at IBM Corporation $194,594 | H1B Salary Data
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H1B Record: I-200-25268-335991
Case Number
I-200-25268-335991
Case Status
Certified
Visa Class
H-1B
Employer
IBM Corporation
Job Title
Packaging Development Engineering Manager
SOC Code
17-2199.06
· Microsystems Engineers
Base Salary
$194,594
Prevailing Wage
$133,598
· IV
Full Time
Yes
Location
Hopewell Junction, NY
Year
2025
Submitted Date
2025-09-25
Start Date
2026-03-24
End Date
2029-03-23