H1B Salary Data

Companies Job Titles Cities

Data sourced from U.S. Department of Labor LCA disclosures.

Contact: admin@h1bdata.net · Privacy Policy

Senior Packaging Engineer at Qualcomm Technologies, Inc $127,200 | H1B Salary Data

← Back to Search

H1B Record: I-200-25225-238585

Case Number

I-200-25225-238585

Case Status

Certified

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Senior Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$127,200

Range: $127,200 – $190,800

Prevailing Wage

$110,656 · II

Full Time

Yes

Location

Year

2025

Submitted Date

2025-08-13

Start Date

2026-01-13

End Date

2029-01-12