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Principal Engineer, Packaging Engineering at Sandisk Technologies, Inc $170,248 | H1B Salary Data

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H1B Record: I-200-25220-231930

Case Number

I-200-25220-231930

Case Status

Certified

Visa Class

H-1B

Employer

Sandisk Technologies, Inc

Job Title

Principal Engineer, Packaging Engineering

SOC Code

17-2112.00 · Industrial Engineers

Base Salary

$170,248

Range: $170,248 – $172,800

Prevailing Wage

$170,248 · IV

Full Time

Yes

Location

Year

2025

Submitted Date

2025-08-08

Start Date

2025-09-15

End Date

2028-09-14