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Packaging Engineer at Intel Corporation $155,251 | H1B Salary Data

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H1B Record: I-200-25213-214916

Case Number

I-200-25213-214916

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$155,251

Range: $155,251 – $256,680

Prevailing Wage

$133,432 · III

Full Time

Yes

Location

Year

2025

Submitted Date

2025-08-01

Start Date

2025-08-05

End Date

2028-08-04