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H1B Record: I-200-25198-183839

Case Number

I-200-25198-183839

Case Status

Certified

Visa Class

H-1B

Employer

Sandisk Technologies, Inc

Job Title

Principal Engineer, Packaging Engineering

SOC Code

17-2141.00 · Mechanical Engineers

Base Salary

$185,869

Range: $185,869 – $195,700

Prevailing Wage

$185,869 · IV

Full Time

Yes

Location

Year

2025

Submitted Date

2025-07-17

Start Date

2025-08-04

End Date

2028-08-03

Principal Engineer, Packaging Engineering at Sandisk Technologies, Inc $185,869 | H1B Salary Data