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Principal Engineer, Advanced Packaging at Micron Technology, Inc $149,023 | H1B Salary Data

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H1B Record: I-200-25168-103998

Case Number

I-200-25168-103998

Case Status

Certified

Visa Class

H-1B

Employer

Micron Technology, Inc

Job Title

Principal Engineer, Advanced Packaging

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$149,023

Prevailing Wage

$110,094 · IV

Full Time

Yes

Location

Year

2025

Submitted Date

2025-06-17

Start Date

2025-09-16

End Date

2028-09-15