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Embedded 5G/4G Cellular Physical Layer DSP Firmware Engineer at Apple Inc $157,800 | H1B Salary Data
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H1B Record: I-200-25163-083871
Case Number
I-200-25163-083871
Case Status
Certified
Visa Class
H-1B
Employer
Apple Inc
Job Title
Embedded 5G/4G Cellular Physical Layer DSP Firmware Engineer
SOC Code
17-2072.00
· Electronics Engineers, Except Computer
Base Salary
$157,800
Range: $157,800 – $237,500
Prevailing Wage
$154,565
· IV
Full Time
Yes
Location
Austin, TX
Year
2025
Submitted Date
2025-06-12
Start Date
2025-08-04
End Date
2028-08-03