H1B Salary Data
Companies
Job Titles
Cities
R&D Equipment Development Engineer- Wafer Bonding at Micron Technology, Inc $120,000 | H1B Salary Data
← Back to Search
H1B Record: I-200-25126-942377
Case Number
I-200-25126-942377
Case Status
Certified
Visa Class
H-1B
Employer
Micron Technology, Inc
Job Title
R&D Equipment Development Engineer- Wafer Bonding
SOC Code
17-2141.00
· Mechanical Engineers
Base Salary
$120,000
Prevailing Wage
$75,462
· II
Full Time
Yes
Location
Boise, ID
Year
2025
Submitted Date
2025-05-06
Start Date
2025-10-01
End Date
2028-09-30