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Packaging Engineer at Intel Corporation $124,090 | H1B Salary Data

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H1B Record: I-200-25126-941188

Case Number

I-200-25126-941188

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$124,090

Range: $124,090 – $175,190

Prevailing Wage

$124,051 · III

Full Time

Yes

Location

Year

2025

Submitted Date

2025-05-06

Start Date

2025-10-17

End Date

2028-10-16