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Semiconductor Packaging Engineer at Nxp USA INC $155,530 | H1B Salary Data

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H1B Record: I-200-25122-932474

Case Number

I-200-25122-932474

Case Status

Certified

Visa Class

H-1B

Employer

Job Title

Semiconductor Packaging Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$155,530

Prevailing Wage

$90,730 · II

Full Time

Yes

Location

Year

2025

Submitted Date

2025-05-02

Start Date

2025-10-01

End Date

2028-09-30