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IC Packaging/Co-Design CAD Applications Engineer at Nxp USA INC $98,088 | H1B Salary Data

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H1B Record: I-200-25120-923167

Case Number

I-200-25120-923167

Case Status

Certified

Visa Class

H-1B

Employer

Job Title

IC Packaging/Co-Design CAD Applications Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$98,088

Prevailing Wage

$84,947 · I

Full Time

Yes

Location

Year

2025

Submitted Date

2025-04-30

Start Date

2025-10-01

End Date

2028-09-30