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Equipment Development Engineer - Wafer Bonding at Micron Technology, Inc $123,000 | H1B Salary Data

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H1B Record: I-200-25115-907609

Case Number

I-200-25115-907609

Case Status

Certified

Visa Class

H-1B

Employer

Micron Technology, Inc

Job Title

Equipment Development Engineer - Wafer Bonding

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$123,000

Prevailing Wage

$70,408 · II

Full Time

Yes

Location

Year

2025

Submitted Date

2025-04-25

Start Date

2025-10-01

End Date

2028-09-30