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Microelectronics Packaging Engineer at Allegro MicroSystems, LLC $100,402 | H1B Salary Data

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H1B Record: I-200-25112-892152

Case Number

I-200-25112-892152

Case Status

Certified

Visa Class

H-1B

Employer

Allegro MicroSystems, LLC

Job Title

Microelectronics Packaging Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$100,402

Prevailing Wage

$100,402 · II

Full Time

Yes

Location

Year

2025

Submitted Date

2025-04-22

Start Date

2025-09-30

End Date

2028-09-29