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Senior Staff Packaging Engineer at Qualcomm Technologies, Inc $180,400 | H1B Salary Data

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H1B Record: I-200-25084-802488

Case Number

I-200-25084-802488

Case Status

Certified

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Senior Staff Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$180,400

Range: $180,400 – $270,600

Prevailing Wage

$166,941 · IV

Full Time

Yes

Location

Year

2025

Submitted Date

2025-03-25

Start Date

2025-06-01

End Date

2028-05-31