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Packaging Engineer at Qualcomm Technologies, Inc $140,805 | H1B Salary Data

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H1B Record: I-200-25070-765939

Case Number

I-200-25070-765939

Case Status

Certified

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Packaging Engineer

SOC Code

17-2061.00 · Computer Hardware Engineers

Base Salary

$140,805

Range: $140,805 – $177,400

Prevailing Wage

$140,805

Full Time

Yes

Location

Santa Clara, CA

Year

2025

Submitted Date

2025-03-11

Start Date

2025-09-04

End Date

2028-09-03