H1B Salary Data

Companies Job Titles Cities

Data sourced from U.S. Department of Labor LCA disclosures.

Contact: admin@h1bdata.net · Privacy Policy

Packaging Engineer at Intel Corporation $144,664 | H1B Salary Data

← Back to Search

H1B Record: I-200-25070-763855

Case Number

I-200-25070-763855

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$144,664

Range: $144,664 – $223,248

Prevailing Wage

$144,664 · III

Full Time

Yes

Location

Santa Clara, CA

Year

2025

Submitted Date

2025-03-10

Start Date

2025-07-29

End Date

2028-07-28