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H1B Record: I-200-25063-742280

Case Number

I-200-25063-742280

Case Status

Certified

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Senior Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$127,200

Range: $127,200 – $190,800

Prevailing Wage

$119,434 · II

Full Time

Yes

Location

Year

2025

Submitted Date

2025-03-04

Start Date

2025-09-02

End Date

2028-09-01

Senior Packaging Engineer at Qualcomm Technologies, Inc $127,200 | H1B Salary Data