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Principal Engineer PACKAGE SILICON INTEGRATION at Micron Technology, Inc $179,500 | H1B Salary Data

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H1B Record: I-200-25056-722221

Case Number

I-200-25056-722221

Case Status

Certified

Visa Class

H-1B

Employer

Micron Technology, Inc

Job Title

Principal Engineer PACKAGE SILICON INTEGRATION

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$179,500

Prevailing Wage

$110,094 · IV

Full Time

Yes

Location

Year

2025

Submitted Date

2025-02-25

Start Date

2025-03-17

End Date

2028-03-16