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Senior Staff Packaging Engineer at Qualcomm Technologies, Inc $162,400 | H1B Salary Data

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H1B Record: I-200-25035-663102

Case Number

I-200-25035-663102

Case Status

Certified

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Senior Staff Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$162,400

Range: $162,400 – $243,600

Prevailing Wage

$145,642 · IV

Full Time

Yes

Location

Year

2025

Submitted Date

2025-02-04

Start Date

2025-07-26

End Date

2028-07-25