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Packaging Engineer at Qualcomm Technologies, Inc $98,500 | H1B Salary Data

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H1B Record: I-200-25030-653299

Case Number

I-200-25030-653299

Case Status

Certified

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$98,500

Range: $98,500 – $147,500

Prevailing Wage

$98,030 · II

Full Time

Yes

Location

Year

2025

Submitted Date

2025-01-30

Start Date

2025-07-22

End Date

2028-07-21