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Staff Packaging Engineer at Qualcomm Technologies, Inc $144,000 | H1B Salary Data

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H1B Record: I-200-25023-636506

Case Number

I-200-25023-636506

Case Status

Certified

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Staff Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$144,000

Range: $144,000 – $216,000

Prevailing Wage

$143,187 · III

Full Time

Yes

Location

Year

2025

Submitted Date

2025-01-23

Start Date

2025-07-19

End Date

2028-07-18