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Principal Engineer Lead - Dry Etch DRAM at Micron Technology, Inc $175,000 | H1B Salary Data
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H1B Record: I-200-24347-538748
Case Number
I-200-24347-538748
Case Status
Certified
Visa Class
H-1B
Employer
Micron Technology, Inc
Job Title
Principal Engineer Lead - Dry Etch DRAM
SOC Code
17-2131.00
· Materials Engineers
Base Salary
$175,000
Prevailing Wage
$90,251
· III
Full Time
Yes
Location
Boise, ID
Year
2024
Submitted Date
2024-12-12
Start Date
2025-02-24
End Date
2028-02-23