H1B Salary Data

Companies Job Titles Cities

Data sourced from U.S. Department of Labor LCA disclosures.

Contact: admin@h1bdata.net · Privacy Policy

Senior Engineer, Packaging at Samsung Semiconductor, Inc $164,299 | H1B Salary Data

← Back to Search

H1B Record: I-200-24142-021975

Case Number

I-200-24142-021975

Case Status

Certified

Visa Class

H-1B

Employer

Samsung Semiconductor, Inc

Job Title

Senior Engineer, Packaging

SOC Code

17-2141.00 · Mechanical Engineers

Base Salary

$164,299

Range: $164,299 – $200,000

Prevailing Wage

$164,299 · IV

Full Time

Yes

Location

Year

2024

Submitted Date

2024-05-21

Start Date

2024-10-01

End Date

2027-09-30