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Packaging Engineer at Intel Corporation $100,722 | H1B Salary Data

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H1B Record: I-200-24117-928770

Case Number

I-200-24117-928770

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$100,722

Range: $100,722 – $138,036

Prevailing Wage

$100,722

Full Time

Yes

Location

Santa Clara, CA

Year

2024

Submitted Date

2024-04-26

Start Date

2024-10-01

End Date

2027-09-30