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Packaging Engineer at Intel Corporation $180,003 | H1B Salary Data

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H1B Record: I-200-24113-909825

Case Number

I-200-24113-909825

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$180,003

Range: $180,003 – $261,082

Prevailing Wage

$153,504 · III

Full Time

Yes

Location

Santa Clara, CA

Year

2024

Submitted Date

2024-04-22

Start Date

2024-10-01

End Date

2027-09-30