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Packaging Engineer I at Medtronic, Inc $63,794 | H1B Salary Data
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H1B Record: I-200-24106-889342
Case Number
I-200-24106-889342
Case Status
Certified
Visa Class
H-1B
Employer
Medtronic, Inc
Job Title
Packaging Engineer I
SOC Code
17-2112.00
· Industrial Engineers
Base Salary
$63,794
Range: $63,794 – $80,000
Prevailing Wage
$63,794
· I
Full Time
Yes
Location
Grand Rapids, MI
Year
2024
Submitted Date
2024-04-15
Start Date
2024-05-06
End Date
2027-05-05