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Packaging Engineer I at Medtronic, Inc $63,794 | H1B Salary Data

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H1B Record: I-200-24106-889342

Case Number

I-200-24106-889342

Case Status

Certified

Visa Class

H-1B

Employer

Job Title

Packaging Engineer I

SOC Code

17-2112.00 · Industrial Engineers

Base Salary

$63,794

Range: $63,794 – $80,000

Prevailing Wage

$63,794 · I

Full Time

Yes

Location

Grand Rapids, MI

Year

2024

Submitted Date

2024-04-15

Start Date

2024-05-06

End Date

2027-05-05