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Senior Engineer, Packaging at Samsung Semiconductor, Inc $135,270 | H1B Salary Data

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H1B Record: I-200-24104-884451

Case Number

I-200-24104-884451

Case Status

Certified

Visa Class

H-1B

Employer

Samsung Semiconductor, Inc

Job Title

Senior Engineer, Packaging

SOC Code

15-1252.00 · Software Developers

Base Salary

$135,270

Range: $135,270 – $160,000

Prevailing Wage

$135,270

Full Time

Yes

Location

Year

2024

Submitted Date

2024-04-12

Start Date

2024-10-01

End Date

2027-09-30