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Packaging Engineer at Intel Corporation $136,739 | H1B Salary Data

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H1B Record: I-200-24052-734509

Case Number

I-200-24052-734509

Case Status

Certified

Visa Class

H-1B

Employer

Intel Corporation

Job Title

Packaging Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$136,739

Range: $136,739 – $186,240

Prevailing Wage

$136,739 · III

Full Time

Yes

Location

Santa Clara, CA

Year

2024

Submitted Date

2024-02-21

Start Date

2024-08-11

End Date

2027-08-10