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Embedded 5G/4G Cellular Physical Layer DSP Firmware Engineer at Apple Inc $136,282 | H1B Salary Data
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H1B Record: I-200-24044-716321
Case Number
I-200-24044-716321
Case Status
Certified
Visa Class
H-1B
Employer
Apple Inc
Job Title
Embedded 5G/4G Cellular Physical Layer DSP Firmware Engineer
SOC Code
17-2072.00
· Electronics Engineers, Except Computer
Base Salary
$136,282
Range: $136,282 – $198,100
Prevailing Wage
$136,282
· III
Full Time
Yes
Location
San Diego, CA
Year
2024
Submitted Date
2024-02-13
Start Date
2024-02-19
End Date
2027-02-18