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Senior Staff Packaging Engineer at Qualcomm Technologies, Inc $188,926 | H1B Salary Data
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H1B Record: I-200-23268-379257
Case Number
I-200-23268-379257
Case Status
Certified
Visa Class
H-1B
Employer
Qualcomm Technologies, Inc
Job Title
Senior Staff Packaging Engineer
SOC Code
17-2072.00
· Electronics Engineers, Except Computer
Base Salary
$188,926
Range: $188,926 – $264,500
Prevailing Wage
$180,003
· IV
Full Time
Yes
Location
Santa Clara, CA
Year
2023
Submitted Date
2023-09-25
Start Date
2024-03-22
End Date
2027-03-21