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Wafer Processing Engineer at IPG Photonics Corporation $88,026 | H1B Salary Data

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H1B Record: I-200-23102-926274

Case Number

I-200-23102-926274

Case Status

Certified

Visa Class

H-1B

Employer

IPG Photonics Corporation

Job Title

Wafer Processing Engineer

SOC Code

17-2131.00 · Materials Engineers

Base Salary

$88,026

Range: $88,026 – $89,000

Prevailing Wage

$88,026 · II

Full Time

Yes

Location

Year

2023

Submitted Date

2023-04-12

Start Date

2023-10-01

End Date

2026-09-30