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Android Build and Release Engineer at 3MD Inc $104,853 | H1B Salary Data
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H1B Record: I-200-23097-915654
Case Number
I-200-23097-915654
Case Status
Certified
Visa Class
H-1B
Employer
3MD Inc
Job Title
Android Build and Release Engineer
SOC Code
15-1252.00
· Software Developers
Base Salary
$104,853
Range: $104,853 – $145,600
Prevailing Wage
$104,853
Full Time
Yes
Location
Redmond, WA
Year
2023
Submitted Date
2023-04-07
Start Date
2023-10-01
End Date
2026-09-30