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Packaging Development Engineering Manager at IBM Corporation $161,498 | H1B Salary Data
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H1B Record: I-200-23065-825402
Case Number
I-200-23065-825402
Case Status
Certified
Visa Class
H-1B
Employer
IBM Corporation
Job Title
Packaging Development Engineering Manager
SOC Code
17-2199.06
· Microsystems Engineers
Base Salary
$161,498
Prevailing Wage
$94,619
· II
Full Time
Yes
Location
Hopewell Junction, NY
Year
2023
Submitted Date
2023-03-06
Start Date
2023-03-24
End Date
2026-03-23