H1B Salary Data
Companies
Job Titles
Cities
We use cookies to improve your experience and analyze site traffic.
Privacy Policy
Decline
Accept
Packaging Engineer at Intel Corporation $134,514 | H1B Salary Data
← Back to Search
H1B Record: I-200-23061-816359
Case Number
I-200-23061-816359
Case Status
Certified
Visa Class
H-1B
Employer
Intel Corporation
Job Title
Packaging Engineer
SOC Code
17-2131.00
· Materials Engineers
Base Salary
$134,514
Range: $134,514 – $186,240
Prevailing Wage
$134,514
· III
Full Time
Yes
Location
Santa Clara, CA
Year
2023
Submitted Date
2023-03-02
Start Date
2023-08-16
End Date
2026-08-15