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Senior Wafer Slicing Engineer at CubicPV, Inc $100,000 | H1B Salary Data

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H1B Record: I-200-23058-807242

Case Number

I-200-23058-807242

Case Status

Withdrawn

Visa Class

H-1B

Employer

Job Title

Senior Wafer Slicing Engineer

SOC Code

17-2141.00 · Mechanical Engineers

Base Salary

$100,000

Prevailing Wage

$84,594 · II

Full Time

Yes

Location

Year

2023

Submitted Date

2023-02-27

Start Date

2023-08-25

End Date

2026-08-24