H1B Salary Data
Companies
Job Titles
Cities
We use cookies to improve your experience and analyze site traffic.
Privacy Policy
Decline
Accept
Senior Packaging Engineer at Qualcomm Technologies, Inc $115,500 | H1B Salary Data
← Back to Search
H1B Record: I-200-23023-719845
Case Number
I-200-23023-719845
Case Status
Certified
Visa Class
H-1B
Employer
Qualcomm Technologies, Inc
Job Title
Senior Packaging Engineer
SOC Code
17-2072.00
· Electronics Engineers, Except Computer
Base Salary
$115,500
Range: $115,500 – $173,500
Prevailing Wage
$108,638
· II
Full Time
Yes
Location
Austin, TX
Year
2023
Submitted Date
2023-01-23
Start Date
2023-07-13
End Date
2026-07-12