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Packaging Engineer at Qualcomm Technologies, Inc $108,638 | H1B Salary Data

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H1B Record: I-200-22364-666088

Case Number

I-200-22364-666088

Case Status

Withdrawn

Visa Class

H-1B

Employer

Qualcomm Technologies, Inc

Job Title

Packaging Engineer

SOC Code

17-2072.00 · Electronics Engineers, Except Computer

Base Salary

$108,638

Range: $108,638 – $147,500

Prevailing Wage

$108,638 · II

Full Time

Yes

Location

Year

2022

Submitted Date

2022-12-30

Start Date

2023-01-04

End Date

2026-01-03