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Packaging Engineer III at Array Technologies, INC $115,000 | H1B Salary Data

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H1B Record: I-200-22291-535835

Case Number

I-200-22291-535835

Case Status

Certified

Visa Class

H-1B

Employer

Array Technologies, INC

Job Title

Packaging Engineer III

SOC Code

17-2112.00 · Industrial Engineers

Base Salary

$115,000

Prevailing Wage

$102,523 · III

Full Time

Yes

Location

Year

2022

Submitted Date

2022-10-18

Start Date

2022-11-14

End Date

2025-11-13