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Dry Etch Process Development Engineer at Micron Technology, Inc $118,938 | H1B Salary Data
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H1B Record: I-200-22006-811966
Case Number
I-200-22006-811966
Case Status
Certified
Visa Class
H-1B
Employer
Micron Technology, Inc
Job Title
Dry Etch Process Development Engineer
SOC Code
17-2131.00
· Materials Engineers
Base Salary
$118,938
Prevailing Wage
$95,056
· IV
Full Time
Yes
Location
Boise, ID
Year
2022
Submitted Date
2022-01-06
Start Date
2022-06-30
End Date
2025-06-29