H1B Salary Data
Companies
Job Titles
Cities
We use cookies to improve your experience and analyze site traffic.
Privacy Policy
Decline
Accept
Packaging Engineer at Intel Corporation $89,981 | H1B Salary Data
← Back to Search
H1B Record: I-200-21032-044833
Case Number
I-200-21032-044833
Case Status
Certified
Visa Class
H-1B
Employer
Intel Corporation
Job Title
Packaging Engineer
SOC Code
17-2131.00
· Materials Engineers
Base Salary
$89,981
Range: $89,981 – $144,660
Prevailing Wage
$89,981
· II
Full Time
Yes
Location
Santa Clara, CA
Year
2021
Submitted Date
2021-02-01
Start Date
2021-04-11
End Date
2024-04-10