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Principal Engineer - Dry Etch at Micron Technology, Inc $147,175 | H1B Salary Data

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H1B Record: I-200-20297-887108

Case Number

I-200-20297-887108

Case Status

Certified

Visa Class

H-1B

Employer

Micron Technology, Inc

Job Title

Principal Engineer - Dry Etch

SOC Code

17-2131 · Materials Engineers

Base Salary

$147,175

Prevailing Wage

$127,150 · IV

Full Time

Yes

Location

Year

2020

Submitted Date

2020-10-23

Start Date

2020-11-06

End Date

2023-11-05