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Packaging Engineer at Intel Corporation $167,814 | H1B Salary Data
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H1B Record: I-200-20287-876536
Case Number
I-200-20287-876536
Case Status
Certified
Visa Class
H-1B
Employer
Intel Corporation
Job Title
Packaging Engineer
SOC Code
17-2131
· Materials Engineers
Base Salary
$167,814
Range: $167,814 – $169,810
Prevailing Wage
$167,814
· III
Full Time
Yes
Location
Santa Clara, CA
Year
2020
Submitted Date
2020-10-13
Start Date
2020-11-21
End Date
2023-11-20